The Oxford Applied Research RF ion sources are employed in applications
where ion-beam etching, sputter deposition or assisted deposition are
required with minimal contamination. The inductively-coupled discharge
requires no hot cathode and, with the exception of the extraction grids,
takes place entirely within an ultra-pure ceramic discharge zone. This
configuration lends itself to operation with reactive gases, such as oxygen,
hydrogen or nitrogen without the accelerated degradation of the discharge
zone as observed in filament-driven ion sources.
Model | HD20 | HD25 | HD60 | HD150 |
In-vacuum diameter | 34 mm | 57 mm | 96 mm | 196 mm |
Standard length | 290 mm | 290 mm | 290 mm | 212 mm |
Beam diameter | 20 mm | 25 mm | 50 mm | 150 mm |
Mounting flange |
NW35CF (70 mm / 2.75") |
NW63CF (114 mm / 4.5") |
NW100CF (150 mm / 6") |
NW200CF (250 mm / 10") |
Max. operating power | 400 W | 600 W | 600 W | 1,200 W |
Note: OAR also manufactures model HD25R specially for users of some Riber MBE Systems with non- standard port sizes. Please ask us for details.
Flux: At a working distance of 100 mm > 1 x 10-16 atoms/cm²/sec
Standard equipment supplied: Source (to user-specified length & with viewport to Plasma), RF cable, Manual Tuning unit, ion deflection plates and power supply
Services: 0.5 l / min water cooling
Operating pressure: All sources can operate at chamber pressure < 5 x 10 -³ mbar