The Oxford Applied Research RF ion sources are employed in applications
where ion-beam etching, sputter deposition or assisted deposition are
required with minimal contamination. The inductively-coupled discharge
requires no hot cathode and, with the exception of the extraction grids,
takes place entirely within an ultra-pure ceramic discharge zone. This
configuration lends itself to operation with reactive gases, such as oxygen,
hydrogen or nitrogen without the accelerated degradation of the discharge
zone as observed in filament-driven ion sources.
Model | RF25 | RF50 | RF150 |
In-vacuum diameter | 59mm | 98mm | 198mm |
Beam diameter | 25mm | 50mm | 150mm |
Mounting flange * | NW63CF | NW100CF | NW200CF |
Ion beam energy | 100-1000eV | 100-1000eV | 100-1000eV |
Beam current density | >3mA/cm2 | >6mA/cm2 | >3mA/cm2 |
Operating gas flow | 5-10sccm | 5-10sccm | 10-20sccm |
Standard tuning unit | Manual | Manual | Automatic |
Power supplies |
600W RF and screen grid |
0123-600W RF and screen grid |
600W RF, screen and accelerator |
Grid material |
Graphite, Mo, Ti |
Graphite, Mo, Ti | Mo, Ti |
Water cooling | 0.5l/s at 20oC | 0.5l/s at 20oC | 0.5l/s at 20oC |
*For externally mounted source. Internally mounted sources are also available | |||